ArcticLink II VX4C

VEE and DPO-enabled Platform Optimized For Qualcomm Mobile Processors

The ArcticLink® II VX4C solution platform integrates two main Proven System Blocks (2nd generation VEE™ technology, Display Power Optimizer (DPO) and MDDI v1.2 Type 2 Client with PHY) coupled with CellularRAM Frame Buffer and Programmable Fabric. This highly integrated, yet flexible architecture makes it the ideal platform to implement Customer Specific Standard Product (CSSP) solutions in the display and connectivity subsystems of Smartphones, Netbooks, Mobile Internet Devices (MIDs), Mobile Computing Devices (MCDs) and Pocketable Computing Devices (PCDs) using Qualcomm’s latest Mobile Station Modem (MSM™) MSM7xxx-series and MSM8xxx-series mobile processors, including the recently announced Snapdragon family.

The ArcticLink II VX4C solution platform can be used to replace several discrete components typically used in mobile devices today, reducing power consumption and BOM cost, saving precious PCB space, and reduce the size of cables and connectors used in hinged form factor products such as clamshell, swivel, and slider . The onboard programmable fabric enables an almost endless combination of interface standards and functionality to enable extremely efficient and future-proof system design. QuickLogic’s System Solutions Group (SSG) provides the Proven System Blocks (PSBs), software drivers, documentation, reference schematics and support to help accelerate OEM and ODM time-to-market with CSSPs based on the ArcticLink II VX4C solution platform.