CSSP Solutions

CSSP Packages

In the mobile market, semiconductor package size is a critical requirement and often will impact whether a differentiating feature will be added to a product. QuickLogic partners with industry leading packaging vendors and makes significant investment package technology development to ensure we are delivering CSSPs optimized for the cost, board space and reliability needs of the mobile market. Figure 3 illustrates the various packaging types QuickLogic supports today including small foot print BGA packages and wafer level CSP.

Packaging Types

CSSP Software Drivers

Development teams are continually finding that successful product delivery is highly dependent on the availability of robust software, including drivers, middleware and applications. QuickLogic understands this and firmly believes that a “solution” is more than just a semiconductor device – a “solution” includes software drivers that can be integrated seamlessly into a company’s board support package (BSP). QuickLogic’s system software team has experience delivering drivers for Windows CE, Windows Mobile , Android and Linux operating systems.

Software Drivers Supported by QuickLogic’s CSSP Solution