CSSP Solutions - Customer Specific Standard Products

CSSP Packages

In the mobile market, semiconductor package size is a critical requirement and often will impact whether a differentiating feature will be added to a product. QuickLogic partners with industry leading packaging vendors and makes significant investment package technology development to ensure we are delivering CSSPs optimized for the cost, board space and reliability needs of the mobile market. Figure 3 illustrates the various packaging types QuickLogic supports today including small foot print BGA packages and wafer level CSP. The following figure illustrates the various packaging types QuickLogic supports today including Wafer Level CSP and small foot print BGA packages.

Packaging Types