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CSSP Platforms
Architects and engineers have varying requirements for semiconductor functionality, board space and cost in their mobile products. Furthermore, engineering managers prefer that their companies make R&D investments and partner with suppliers that have a breadth of solutions to cover these varying requirements, including a roadmap that accommodates future unknown requirements.
QuickLogic meets these needs by providing several silicon platforms that span the capacity and integration requirements of most mobile systems.
ArcticLink™ II Solution Platform
ArcticLink II is the world’s first ultra-low power, solution platform optimized for Visual Enhancement Engine (VEE™).
QuickLogic has partnered with Apical Limited to bring the patented VEE technology to the mobile world.
VEE technology transforms the mobile multimedia experience by:
- Significantly enhancing image/video quality through dynamic range control
- Allowing viewing image/video quality under low backlight or bright ambient light conditions
For more information on ArcticLink II solution platform
ArcticLink™ Solution Platform
ArcticLink is a programmable solution platform designed specifically to meet the unique connectivity requirements of handheld devices.
With the explosion of new handheld applications and devices, customers are demanding multiple functions to be performed at optimal levels by a single device. As a result, designers of handheld products such as Smartphones, Personal Media Players and Portable Navigation Devices are faced with the challenge of integrating enhanced wireless connectivity and digital storage features, among others.
For more information on ArcticLink solution platform
PolarPro® & PolarPro® II Solution Platform
The award winning PolarPro families of programmable platforms, including PolarPro and PolarPro II, were purposely architected to meet the interconnect and system logic requirements of power sensitive and portable applications. The PolarPro family offers a spectrum of platforms with varying amounts of customizable building blocks, embedded SRAM and advanced clock management.
