- Enables system verification for space-constrained portable consumer electronics applications
- Low socket profile keeps the board height at chip level
QuickLogic Corporation (NASDAQ: QUIK), the pioneer of Embedded Standard Products (ESPs) and leader in low power programmable logic, today announced the availability of the HiLo socket from Interconnect Systems, Inc. (ISI). The HiLo development sockets allow designers to easily prototype their space-constrained designs using footprint-compatible sockets.
The HiLo socketing system can reduce development costs by allowing the same printed circuit board to be used for prototyping and production, thus cutting down on system development time. When every millimeter counts, the low-profile 2mm socket height enables low-profile prototypes since the board height, a critical constraint for handheld applications, remains at chip level.
For chip mounting using the HiLo system, the chip is attached to a pin field and a socket is soldered to the printed-circuit board. The pin field is then inserted into the socket. The pin field and socket combination accommodates multiple applications including production IC board mounting, board-to-board connection and other creative uses. The HiLo socket requires less insertion force per contact, supports high-speed applications, and is "pick and place" compatible.
"Success of consumer electronics products depends greatly on the adoption of new technology and the rate at which products are delivered to market," said Brian Faith, Senior Director of Product Marketing. "In providing the HiLo socket system to designers of consumer applications, we help cut their development costs and speed time to market by allowing them to develop their system with the same printed circuit board as they intend to use for production, eliminating the need for board spins late in the design cycle.
The ISI HiLo sockets are available from ISI for as low as $93.00. For additional company or product information, please go to www.quicklogic.com or to www.isipkg.com
This news release contains forward-looking statements based on current expectations that involve risks and uncertainties. QuickLogic's actual results may differ from the results described in the forward-looking statements. Factors that could cause actual results to differ include, but are not limited to, general conditions in the semiconductor industry, development risks, market acceptance and the impact of competitive products. These and other risk factors are detailed in QuickLogic's periodic reports and registration statements filed with the Securities and Exchange Commission.
QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.
The QuickLogic name and logo are registered trademarks of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.