- Mobile Application Board allows designers to experiment with performance, power and cost trade-offs
- Developers begin software development before production hardware is delivered, providing dramatic decrease in overall design time
QuickLogic Corporation (NASDAQ: QUIK), the low-power programmable logic leader, today announced availability of their Mobile Application Board (MAB) for the Intel® PXA27x based Processor Developer’s Kit ("Mainstone" DVK), providing seamless connectivity between the Intel XScale processor and peripheral interfaces such as Mini PCI, CardBus, SDIO and IDE.
The FPGA-based MAB enables IP development and performance verifications for a variety of peripherals such as Wi-Fi, HDDs (Hard Disk Drives), 10/100/1G Ethernet, MPEG devices, SD memory, and many more. It connects directly into the VLIO connector of the DVK, which allows designers to make system measurements and architecture tradeoffs including power consumption, performance and cost.
The QuickLogic MAB lets designers begin software development prior to receiving final hardware. This ability to design hardware and software in parallel can provide product designers with a critical competitive advantage by significantly reducing time spent in development of popular portable products including Global Positioning Systems (GPS), smart phones, Portable Media Players (PMP), and Portable Industrial Systems. “With the Eclipse II FPGAs, reference designs, the MAB and vast experience in the design of portable products, we have created a complete and easy to implement bridging solution for the Intel PXA27 processor,” said Brian Faith, Sr. Product Marketing Director at QuickLogic. “Our FPGA-based bridging solution provides key advantages of decreased design time through hardware/software co-design and design reuse, along with ultra low-power, flexibility and programmability. QuickLogic is also planning on releasing a new MAB based on PolarPro, the lowest power FPGA, by end of Q1, 2006.”
The QuickLogic Mobile Application Board is available today. Complete solution packs are available for both Wi-Fi and HDD connectivity. They include the Mobile Application Board, an Eclipse II QL8325 device in the 484-ball BGA package, reference design files and software drivers for Windows® CE, Windows Mobile, and Linux. Cost for the solution pack is $999. For more information, please visit: www.quicklogic.com/MAB
For more information on Eclipse II FPGAs, visit www.quicklogic.com/lowpower
This news release contains forward-looking statements relating to, among others, the expected benefits of any QuickLogic products and their expectations regarding availability dates and pricing. QuickLogic’s actual results may differ materially from the results described in the forward-looking statements. Factors that could cause actual results to differ include, but are not limited to, a delay in the availability of Quick Logic products, the performance and market acceptance of such product technology and the impact of competitive products, general conditions in the semiconductor industry and related development risks. Certain other risk factors are detailed in QuickLogic’s periodic reports and registration statements filed with the Securities and Exchange Commission. These forward-looking statements speak only as of the date hereof. QuickLogic disclaims any obligation to update these forward-looking statements.
QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.
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