Packages

QuickLogic partners with industry leading packaging companies, and makes significant investments in package technology development to ensure we are delivering Customer Specific Standard Products (CSSPs), Programmable Devices and Bridges optimized for cost, board space and reliability.

Table 1 below illustrates the various CSSP platform packaging types and Table 2 below illustrates the various Programmable Device and Bridge packaging types.

Table 1: CSSP Platform Packages

Wafer Level Chip Scale

Ball Grid Array

PBGA = Plastic Ball Grid Array
LBGA = Low-Profile Ball Grid Array
TFBGA = Thin & Fine-Pitch Ball Grid Array

*1 Please refer to the PolarPro platform data sheet for the mechanical drawing
*2 Please refer to the ArcticLink platform data sheet for the mechanical drawing

Table 2: Programmable Device and Bridge Packages

Quad Flat Package

VQFP = Very Thin Quad Flat Package
PQFP = Plastic Quad Flat Package
TQFP = Thin Quad Flat Package

Ball Grid Array

PBGA = Plastic Ball Grid Array
LBGA = Low-Profile Ball Grid Array
TFBGA = Thin & Fine-Pitch Ball Grid Array

*1: This Package is unique to QuickPCI-QL5064
*2: Overall Package Height is 1.93 (2 Layer Package) 
*3: Overall Package Height is 2.13 (4 Layer Package)
*4: This Package is unique to QuickRAM