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What is ViaLink?
ViaLink is the patented technology that serves as the foundation for the customizable building block technology used in all QuickLogic silicon platforms and products. ViaLinks are electrically programmable, enabling QuickLogic and our customers to quickly customize all of our platforms and products, within minutes, to meet customer-specific requirements. Since ViaLinks are based on a standard ASIC via using standard ASIC via design rules, ViaLink technology is manufactured as part of the bulk CMOS logic processes at our foundry partners Taiwan Semiconductor Manufacturing Company (TSMC) and Tower Semiconductor Limited (TSL).
Block Diagrams
ViaLink Technology
ViaLink Features and Benefits
Electrically Programmable
Enables customization of a die after fabrication of a wafer, yielding fastest possible time to market and ability to react quickly to the dynamic volumes of the consumer market.
Low Power Consumption
Improves Battery Life and Heat Dissipation.
Small Physical Size
Enables Small Form Factor packaging for improved PCB area; small die size for improved manufacturing cost.
Non-Volatile
Single chip solution reduces required PCB area; single supplier simplifies sourcing issues; ability to ship a known good die for System-In-Package (SIP).
