ViaLink

Features and Benefits: ViaLink

Electrically Programmable Enables customization of a die after fabrication of a wafer, yielding fastest possible time to market and ability to react quickly to the dynamic volumes of the consumer market.

Low Power Consumption Improves Battery Life and Heat Dissipation.

Small Physical Size Enables Small Form Factor packaging for improved PCB area; small die size for improved manufacturing cost.

Non-Volatile Single chip solution reduces required PCB area; single supplier simplifies sourcing issues; ability to ship a known good die for System-In-Package (SIP).