Global sensitivities towards the environment and needs for Lead Free Systems continue to increase. The use of lead and other harmful compounds in commercial & industrial devices is a growing environmental problem. This has lead to directives such as RoHS (Restriction of the use of certain Hazardous Substances) from the European Union and the Japan Ministry of Trade and Industry (MITI). All manufacturers supplying products to these countries will have to comply with these regulations.
Meeting RoHS Directive (2002/95/EC) requires the removal of lead (Pb) as well as the following additional hazardous substances:
QuickLogic is strongly committed to the movement to eliminate the use of lead and other hazardous materials in our products. This is in alignment with our corporate Environment, Health and Safety direction.
All QuickLogic Lead Free products are 100% RoHS compliant. QuickLogic plastic non-Pb-Free components are RoHS compliant with respect to applications as stated in the EU Directive Annex, e.g. servers, storage, storage array systems and network infrastructure equipment.
A major impact on semiconductor components is the ability to handle the higher reflow temperatures required for board mounting of Lead Free solder systems. This is due to the different material sets used to assemble packages in order to meet Lead Free requirements.
QuickLogic has chosen the Sn/Ag/Cu alloy as the solder ball alloy for laminate/ball grid array products, and Sn(matte) as the lead finish for lead-frame based products.
The table below shows the QuickLogic devices available in lead free packaging.
|Device family||Packages available|
|ArcticLink 3 S1||64BGA, 30WLCSP|
|PolarPro 3||64BGA, 30WLCSP|
|ArcticLink III VX & BX||120WLCSP|
|ArcticLink II VX||121TFBGA|
|ArcticLink||121TFBGA *5, 196TFBGA (12x12mm)|
|PolarPro I & II||144TQFP, 256LBGA, 324LBGA, 86TFBGA *3, 121TFBGA *3, 132TFBGA *3, 196TFBGA *4|
|Eclipse II||100VQFP, 101TFBGA *3 , 144TQFP, 196TFBGA (both 12x12mm and 8x8mm packages), 208PQFP, 280LFBGA, 484PBGA|
|QuickPCI||144TQFP, 196TFBGA, 208PQFP *1 , 256PBGA, 280LFBGA *1 , 456PBGA, 484PBGA *1|
|QuickRAM||100TQFP, 144TQFP, 208PQFP, 256PBGA, 456PBGA|
|pASIC 3||100TQFP *2 , 144TQFP, 208PQFP, 256PBGA, 456PBGA|
*1: Lead Free package not available for QL5732, and QL5632
*2: Lead Free package not available for QL3004E, and QL300
*3: 0.5mm pitch package
*4: Available in 0.8mm and 0.5mm pitches
*5: 0.65mm pitch package
Mature QuickLogic Lead Free products are denoted by an “N” between the package letters and the number of leads/balls. For example QL8325-6PQ208C will become QL8325-6PQ N 208C for the Lead Free option.