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QuickLogic Blog

eFPGA Complements OpenHW CORE-V MCU at Embedded World

OpenHW Group's CORE-V MCU Development Kit

At the recent Embedded World Conference in Nuremberg Germany, Digi-Key’s Paige West interviewed Rick O’Connor, the President, and CEO at OpenHW Group, about the organization’s CORE-V MCU Development Kit for IoT applications. As Rick mentions in the interview, OpenHW Group is a non-profit open-source ecosystem with 88 partners and members around the world focused on […]

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eFPGA and Chiplet Technology – A Natural Combination

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template

Chiplets (modular silicon “chips” mounted as die onto an interposer which interconnects them and attaches to a single package substrate) have been quietly but steadily taking market share from more traditional monolithic semiconductor devices. In fact, Transparency Market Research recently noted that “…the chiplet market is expected to exceed $47B by 2031, with a CAGR […]

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Happy New Year!

QuickLogic

Welcome to 2022, everyone. I’m really excited by the potential it holds as all the work we’ve been putting in over the last few years starts coming to fruition. While those efforts resulted in many new initiatives and products for the company, I’d like to take a minute to highlight a handful of the most […]

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Have Fun with SparkFun QuickLogic Thing Plus Contest and Win Prizes!

SparkFun, the Open-Source FPGA Foundation (OSFPGA) and QuickLogic are teaming up to sponsor a new contest based on the SparkFun QuickLogic Thing Plus – EOS S3 development kit. This tiny but incredibly capable platform combines SparkFun’s Thing Plus form factor and Qwicc® connect system with QuickLogic’s EOS S3 multicore MCU, embedded FPGA, and QuickLogic Open […]

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Proof Positive: The Quickest Way to Generate Customized Embedded FPGA IP

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On September 8th of this year, we announced the release of our new Australis™ eFPGA IP Generator tool, touting its ability to quickly generate custom eFPGA IP, optimized for power, performance and area, for nearly any foundry/process node combination. Now, a short seven weeks later, we are announcing the first customer success story in which […]

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Our Australis Announcement Heralds the New Era of “Mass Customization”

Several Key Challenges Facing Our Industry We are at a unique inflection point in the semiconductor industry. On one hand, the physical manifestation of Moore’s Law has given us devices with amazing capabilities. On the other hand, as an industry we are struggling to continue down that path as power consumption, density and other physical […]

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