SRAM FPGAs ideal for battery powered, low power reconfigurable applications. Supported both open source and our own proprietary software tools. We are proud to be the 1st Programmable Logic company to openly embrace Open Source FPGA tools through our QuickLogic Open Reconfigurable Computing initiative.
Our SRAM FPGAs are designed specifically for lowest system power. PolarPro3 is ideal for battery powered applications requiring a level of flexibility or re-programmability such as bus interface logic, level shifting, small CPU cores, low speed serial protocols, and GPIO muxing applications commonly found in Consumer and Industrial IoT applications
Benefits
Solve the most challenging embedded systems architecture challenges through the use of small FPGAs - chip-to-chip connectivity, system power consumption, system latency, and time-to-market.
Features
- Reprogrammable SRAM technology
- Supported by Open Source FPGA tools
- Integrated embedded block RAM with dedicated FIFO controllers
Use Cases
- I/O Level shifting /expansion (interface to different bus or IO voltages)
- Bus Interfaces (MCU to memory, MCU 2 MCU, MCU to peripherals/Displays/I2C/I2S/SPI/UART/PWM)
PolarPro3 Documentation |
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Solution Platform Brief |
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Interprocessor Communications PSB PolarPro 3 |
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Data Sheet |
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PolarPro 3 Device Data Sheet SDIO Client PSB Data Sheet SDIO Host Controller PSB Data Sheet SPI Host Controller Data Sheet Wake-up and Verify PSB Data Sheet |
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White Paper |
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| QuickLogic's PolarPro 3 vs Lattice iCE40 Logic Cell Utilization | |||||||||||||||||||
Product Brief |
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IrDA Barcode Transmitter PSB Product Brief IrDA Remote Control PSB Tunable Antenna PSB |
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Application Note |
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| Quartz Crystal Oscillators with the Polar Pro | |||||||||||||||||||
QuickLogic SRAM Reprogrammable FPGAs for Consumer IoT and Industrial IoT
Ecosystem Partners
PolarPro3 Product Table |
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| Product | PolarPro 3 (WLCSP package) | PolarPro 3 (VFBGA package) | |||||||||||||||||
| Logic Cells | 1,019 | ||||||||||||||||||
| Effective Logic Cells | Average 2X vs Standard Logic Cells | ||||||||||||||||||
| RAM Module Size | 8K (9,216 bits) | ||||||||||||||||||
| Number of RAM Modules | 8 | ||||||||||||||||||
| RAM Bits | 73K | ||||||||||||||||||
| FIFO Controllers | 8 | ||||||||||||||||||
| Distributed Clocks | 5 | ||||||||||||||||||
| I/O Flip-flops | 164 | 220 | |||||||||||||||||
| Flip-flops | 1,019 | ||||||||||||||||||
| Max Gates | 175K | ||||||||||||||||||
| Max GPIOs | 18 | 46 | |||||||||||||||||
| Core Voltage | 1.2V | ||||||||||||||||||
| I/O Voltages | 1.8V, 2.5V, 3.3V | ||||||||||||||||||
| Pin Count | 30 | 64 | |||||||||||||||||
| Package | WLCSP | VFBGA | |||||||||||||||||
| Pitch (Ball/Lead) | 0.4mm | 0.4mm | |||||||||||||||||
| Package Dimensions | 2.09mm x 2.54mm | 3.5mm x 3.5mm | |||||||||||||||||
| MSL | 1 | 3 | |||||||||||||||||
